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3D Printing & AdditivePilotElectronics enclosures

Electronics enclosures — Telecom

IP-rated printed enclosures for sensors and gateways. Delivered for a telecom client in Hyderabad.

Location
Hyderabad
Year
2024
Duration
21 weeks
Team
8 engineers
Interactive 3D · drag to rotate
IP67
IP rating
15k
units
−68%
time to market

The challenge

Data existed but lived in spreadsheets and legacy systems, so decisions were made on instinct rather than evidence.

What we built

A phased rollout: a measured pilot first, then scale-out. The core runs on MJF with Fusion 360, integrated into existing systems through ANSYS.

Delivery timeline

  1. Phase 1

    Discovery sprint and site survey

  2. Phase 2

    Prototype built and tested in the Motera lab

  3. Phase 3

    Pilot on site with before/after measurement

  4. Phase 4

    Scale-out, training and handover

Highlights

  • Designed, built and supported from Motera, Ahmedabad
  • Before-and-after measurements agreed with the client up front
  • Documentation, drawings and source handed over at close
  • Integrated with existing PLC, ERP or GIS systems — no rip-and-replace

Have a problem that needs a machine built for it?

Tell us the constraint — line speed, accuracy, environment, deadline. An engineer will read it and reply with a straight answer, including when the answer is that you don't need us.

We reply to every enquiry within one business day.